TF230AINNOCHILL
Data Center Loop Coolant
For direct-to-chip, cold-plate, CDU and secondary-loop thermal management.
- Architecture
- D2C / CDU
- Type
- Loop coolant
INNOCHILL · Products
Data Center Cooling Fluids
Low-conductivity heat-transfer fluids for direct liquid cooling, CDU and secondary loops.
Thermal Fluids
Low-conductivity heat-transfer fluids for direct liquid cooling, cold-plate, CDU and secondary-loop systems serving AI, HPC and high-density data-center infrastructure.
Choose a data-center coolant model
TF230BINNOCHILL
Low-Conductivity Data Center Coolant
For advanced AI / HPC liquid-cooling loops where electrical conductivity is a key qualification criterion.
- Focus
- Low conductivity
- Architecture
- D2C / CDU
Quick AnswerFor data-center liquid loops, fluid selection should balance electrical conductivity, corrosion protection, thermal performance, cleanliness, materials compatibility and lifecycle monitoring. The correct target depends on the actual architecture and OEM requirement.
Where these fluids are used
01
Direct-to-Chip
Closed-loop cooling through cold plates on CPUs, GPUs and accelerators.
- Low conductivity where specified
- Mixed-metal protection
- Stable pumpability
02
CDU Loops
Coolant distribution units connecting the IT loop with facility heat rejection.
- Long-term stability
- Ion and contamination control
- Service monitoring
03
Secondary Loops
Heat-transfer circuits that isolate facility water from sensitive IT equipment.
- Freeze protection as required
- Material compatibility
- Low maintenance
04
AI / HPC Infrastructure
High-density racks with elevated heat flux and tighter fluid specifications.
- Verified test data
- Clean filling practice
- Lifecycle limits
Engineering selection criteria
| Criterion | What to confirm before qualification |
|---|---|
| Electrical conductivity | New-fluid target, measurement temperature, in-service limit and customer/OEM requirement. |
| Thermal performance | Thermal conductivity, specific heat, viscosity and expected flow regime. |
| Corrosion control | Aluminum, copper, brass, steel and brazed interfaces in the loop. |
| Materials compatibility | EPDM, hoses, seals, plastics and coatings in contact with the coolant. |
| Lifecycle | Filtration, sampling, refill water/fluid quality, contamination control and replacement criteria. |
Qualification workflow
01 · DefineArchitecture, temperatures and electrical requirement
02 · VerifyMaterials, test data and customer specification
03 · ValidateSample / bench / system-level qualification
Representative platform
TF230B is used within INNOCHILL data-center development and customer discussions. Final published product claims should remain tied to the approved TDS and customer qualification requirements.