INNOCHILL · Solutions

AI & Data Center Cooling

Direct-to-chip, CDU and immersion cooling fluid architectures.

Thermal Fluids

AI and high-density computing are moving thermal design beyond conventional air cooling. INNOCHILL separates direct liquid cooling from immersion cooling because the fluid qualification logic is fundamentally different.

Quick AnswerDirect-to-chip and CDU loops generally use controlled heat-transfer fluids where conductivity, corrosion, cleanliness and material compatibility matter. Single-phase immersion places electronics directly in a dielectric liquid, so insulation, resistivity, viscosity, flash point and electronic-material compatibility become central.

Cooling architectures

Direct-to-Chip / Cold Plate

Fluid circulates through cold plates attached to CPUs, GPUs or other heat sources.

Conductivity and cleanliness
Corrosion protection
Viscosity and heat transfer

CDU / Secondary Loop

The fluid transfers heat between the IT loop, CDU and facility loop.

Long-term stability
Mixed-material compatibility
Monitoring and filtration

Single-Phase Immersion

Servers or electronics operate while fully immersed in a dielectric liquid.

Dielectric strength
Volume resistivity
Flash point and stability
Cable / polymer compatibility

Fluid Lifecycle

Storage, filling, sampling, contamination control and replacement criteria must be planned alongside initial fluid selection.

Selection matrix

Criterion	Direct liquid cooling	Immersion cooling
Electrical property	Conductivity / ion control	Dielectric strength / resistivity
Thermal property	Heat transfer, specific heat, viscosity	Heat transfer, viscosity, density
Materials	Metals, hoses, seals	Electronics, cables, plastics, seals, metals
Safety	System-specific fluid safety	Flash/fire point, handling, oxidation stability